Home / Products / HS-2250 1500°C High-Temperature Inorganic Adhesive
Photo shows A and B bottles labelled 800 g each (1.6 kg total). Standard supply: 1.6 kg/set or 12 kg/set. The label shows A:B = 1:1; the product specification permits 1:1–2 by weight.
HS-2250 1500°C High-Temperature Inorganic Adhesive
Model: HS-2250
Two-part inorganic adhesive for refractory and ceramic bonding, with continuous service up to 1500°C.
- Continuous service temperature up to 1500°C
- For refractory materials and ceramic assemblies
- Two-part, heat-cured bonding and sealing
Packaging: 1.6 kg/set or 12 kg/set
Overview
HS-2250 is a two-part, heat-cured inorganic adhesive for high-temperature bonding and sealing of refractory materials, ceramic assemblies and kiln components.
The supplied specification states continuous service from −40°C to +1500°C and a short-term peak of +1600°C. Validate suitability with your substrates, joint geometry and service conditions.
Not suitable for high-temperature potting of aluminum lamp bases.
Technical specifications
| Continuous temperature | −40°C to +1500°C |
|---|---|
| Short-term peak | +1600°C; validate in your application |
| Mix ratio by weight | A:B = 1:1–2 (1 part A to 1–2 parts B) |
| Potting / filling ratio | A:B = 1:1.8–2 by weight |
| Mixed material use period | Use within 2 hours |
| Recommended staged cure | After application: room temperature 2 h → 40°C 1.5 h → 65°C 2 h → 100°C 2 h; cool with the oven |
| Close-fitting joint cure | Heat with the oven to 100°C; hold 2 hours, then cool before removal |
| Tensile shear strength | ≥1.5 MPa after 100°C × 2-hour cure |
| Pressure resistance | ≥5.0 MPa after 100°C × 2-hour cure; test method not specified |
| Appearance | A: grey-white viscous liquid; B: white powder; cured: grey-white hard solid |
| Storage | ≤28°C, RH≤70%; cool, dry and ventilated |
| Shelf life | 12 months, sealed and unopened |
| Use limitation | Not suitable for high-temperature potting of aluminum lamp bases |
Applications
- Kiln and refractory component bonding or repair
- High-temperature ceramic assemblies
- Ceramic lamp base joints
- Temperature measurement component fixing and sealing
- Selected high-temperature grooves and joints, subject to substrate validation
Application & handling
Clean and dry the surfaces. Mix A:B = 1:1–2 by weight; for filling or potting use 1:1.8–2. Apply mixed material within 2 hours. Discard lumpy or hardened mixed material. Do not use for high-temperature potting of aluminum lamp bases.
Recommended cure after application: room temperature for 2 hours → 40°C for 1.5 hours → 65°C for 2 hours → 100°C for 2 hours, then cool with the oven. The 2-hour initial rest occurs after application, not before use. For close-fitting lamp or sleeve joints, heat with the oven to 100°C and hold for 2 hours, then cool before removal. Do not rely on room-temperature curing. Fully cure before assembly, testing or service.
Wipe uncured excess with a water-dampened cloth. Protect cured parts from humidity and store in sealed moisture-protective bags: moisture absorption can reduce electrical insulation. Request the current SDS for safe handling. Validate the joint and service conditions before production.
Confirm current grade-specific technical and safety data, and validate performance on your actual parts before production.