HS-2280 is a two-part, heat-cured inorganic adhesive for bonding, sealing and potting high-temperature industrial assemblies. The supplied specification states continuous service from -40°C to +1500°C and a short-term peak of 1800°C.

Suitable applications include ceramic components, furnace accessories, temperature measurement assemblies and selected sealing joints. Confirm the substrate, joint design and operating conditions before production.

HS-2250 is a two-part, heat-cured inorganic adhesive for high-temperature bonding and sealing of refractory materials, ceramic assemblies and kiln components.

The supplied specification states continuous service from −40°C to +1500°C and a short-term peak of +1600°C. Validate suitability with your substrates, joint geometry and service conditions.

Not suitable for high-temperature potting of aluminum lamp bases.

HS-2230 is a two-part, heat-cured inorganic adhesive for bonding, sealing and potting industrial components operating at temperatures up to 500°C.

Suitable for ceramic joints, heating element end seals, high-temperature sensor potting and threaded or sleeve joints. Validate the adhesive, joint design and cure process on your actual parts before production.

HS-2240 is a two-part, heat-cured adhesive for bonding, fixing and sealing ceramic lamp bases to quartz glass tubes.

Designed for high-temperature lighting assemblies, with a continuous service range of −40°C to +600°C and a short-term peak of +800°C. Validate the joint design and cure process on your actual parts.

HS-2210 is a two-part inorganic adhesive consisting of liquid A and powder B. It cures to a hard grey-white layer for high-temperature bonding, sealing, filling and repair.

Suitable for dry industrial service from −40°C to +1000°C, with a short-term peak of +1200°C. Select the mix ratio and cure schedule for your joint design and application.