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AMPUDA HS-2240 600°C inorganic adhesive Part A and Part B bottles with English labels.

Photo shows A and B bottles labelled 100 g each. Standard supply: 1.6 kg/set; 16 kg/carton. The label shows A:B = 1:1; the product specification permits 1:1–2 by weight.

AMPUDA materials

HS-2240 High-Temperature Lamp Base Adhesive

Model: HS-2240

Two-part adhesive for ceramic lamp bases and quartz glass tubes, with continuous service up to 600°C.

  • Continuous service temperature up to 600°C
  • For ceramic lamp bases and quartz glass tubes
  • Two-part, heat-cured bonding and sealing

Packaging: 1.6 kg/set · 16 kg/carton

Overview

HS-2240 is a two-part, heat-cured adhesive for bonding, fixing and sealing ceramic lamp bases to quartz glass tubes.

Designed for high-temperature lighting assemblies, with a continuous service range of −40°C to +600°C and a short-term peak of +800°C. Validate the joint design and cure process on your actual parts.

Technical specifications

Continuous temperature−40°C to +600°C
Short-term peak+800°C; validate in your application
Mix ratio by weightA:B = 1:1–2 (1 part A to 1–2 parts B)
Rest time after mixing4 hours before application, for air release
Use periodUse mixed material within the same day
Standard cure80–100°C for 2–4 hours; cool with the oven
Lower-bubble staged cure40°C for 2 hours → 60°C for 2–4 hours; cool with the oven
Tensile shear strength≥1.5 MPa after 100°C × 2-hour cure
Pressure resistance≥5.0 MPa after 100°C × 2-hour cure; test method not specified
AppearanceA: grey viscous liquid; B: white or red powder; cured: grey-white or red solid
Storage≤28°C, RH≤70%; cool, dry and ventilated
Shelf life12 months, sealed and unopened

Applications

  • Ceramic lamp base to quartz glass tube bonding
  • High-temperature equipment lighting assemblies
  • Quartz heating tube and lamp end sealing

Application & handling

Clean and dry the bonding surfaces. Mix A:B = 1:1–2 by weight until uniform. Let the mixture stand for 4 hours to release air before coating or filling. Use within the same day; discard material that has formed lumps or hardened.

Standard cure: 80–100°C for 2–4 hours, then cool with the oven. For the lower-bubble process: hold at 40°C for 2 hours, then 60°C for 2–4 hours and cool with the oven. The strength values are referenced to 100°C × 2-hour cure; validate other cure schedules on your actual parts. Room-temperature cure is very slow and is not recommended.

Fully cure before further assembly or testing. Keep cured parts protected from prolonged humidity. Wipe excess uncured adhesive with a water-dampened cloth and request the current SDS for safe handling.

Confirm current grade-specific technical and safety data, and validate performance on your actual parts before production.