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600 g/set: Part A 200 g + Part B 400 g. Label ratio A:B = 1:2 by weight.
HS-2280 1500°C High-Temperature Inorganic Adhesive
Model: HS-2280
Two-part inorganic adhesive for ceramic bonding, sealing and potting, with continuous service up to 1500°C.
- Continuous service up to 1500°C
- Tensile shear strength ≥3.0 MPa (specified test cure)
- Ceramic bonding, sealing and potting
Packaging: 600 g/set (Part A: 200 g + Part B: 400 g)
Overview
HS-2280 is a two-part, heat-cured inorganic adhesive for bonding, sealing and potting high-temperature industrial assemblies. The supplied specification states continuous service from -40°C to +1500°C and a short-term peak of 1800°C.
Suitable applications include ceramic components, furnace accessories, temperature measurement assemblies and selected sealing joints. Confirm the substrate, joint design and operating conditions before production.
Technical specifications
| Continuous service temperature | -40°C to +1500°C |
|---|---|
| Short-term peak temperature | Up to 1800°C; validate for the application |
| Mix ratio by weight (A:B) | 1:2 label ratio; 1:1.5–2.5 for electric-heating encapsulation |
| Mixed material use period | Use within 4 hours; discard lumpy or hardened material |
| Recommended staged cure | Room temperature 0.5 h → 40°C 1.5 h → 65°C 1 h → 100°C 2 h → cool with oven |
| Tensile shear strength | ≥3.0 MPa after 100°C × 2 h |
| Pressure resistance | ≥5.0 MPa after 100°C × 2 h; test method unspecified |
| Appearance | A: blue-grey viscous liquid; B: light brown-yellow powder |
| Cured appearance | Light brown hard solid |
| Storage conditions | ≤28°C; relative humidity ≤70% |
| Shelf life | 12 months in sealed, unopened original packaging |
Applications
- High-temperature ceramic component bonding
- Temperature measurement probe fixing and potting
- Muffle furnace and refractory accessory bonding
- Selected threaded, flange and sealing-groove joints
- Electric-heating component encapsulation
Application & handling
Clean and dry surfaces. Stir or shake Part B before mixing. For electric-heating encapsulation, use A:B = 1:1.5–2.5 by weight; the label ratio is 1:2. Mix only the quantity needed and use within 4 hours.
After application, rest at room temperature for 0.5 hour, then cure at 40°C for 1.5 hours, 65°C for 1 hour and 100°C for 2 hours. Heat and cool with the oven. Room-temperature curing is slow (about 5–7 days at 20°C) and gives lower strength; it is not recommended. Fully cure before further work.
Wipe uncured excess with a water-dampened cloth. Protect cured assemblies from moisture, which can reduce insulation. Verify substrate compatibility and service performance before production.
Confirm current grade-specific technical and safety data, and validate performance on your actual parts before production.